
Silicon wafers are one of the most important raw materials in the electronics industry, and are mainly used to manufacture integrated circuits, capacitors, diodes and other components. Integrated circuits are tiny circuits composed of a large number of basic components such as transistors, capacitors, resistors, etc., which can be used in various electronic devices such as computers, communication equipment, and entertainment equipment. Semiconductor silicon wafers are one of the core materials for manufacturing integrated circuits. The size of semiconductor silicon wafers is divided into 2 inches (50.8mm), 4 inches (100mm), 6 inches (150mm), 8 inches (200mm), and 12 inches (300mm) according to the diameter. Different silicon wafer sizes and processes are used according to different semiconductor products.
Semiconductor silicon wafer size classification
|
Silicon wafer size |
Thickness |
Area |
Weight |
Corresponding process |
|
|
2 inches |
50.8mm |
279um |
20.26cm² |
1.32g |
5um |
|
4inches |
100mm |
525um |
78.65cm² |
9.67g |
3um-0.5um |
|
6 inches |
150mm |
675um |
176.72cm² |
27.82g |
0.35um-0.13um |
|
8 inches |
200mm |
725um |
314.16cm² |
52.98g |
90mm-55mm |
|
12 inches |
300mm |
775279um |
706.12cm² |
127.62g |
28mm-3mm |
Advantages of large-size silicon wafers • More chips can be manufactured on a single silicon wafer: The larger the wafer, the less waste there is at the edges and corners, which improves the utilization rate of the silicon wafer and reduces costs. Taking 300mm silicon wafers as an example, its usable area is twice that of 200mm silicon wafers under the same process, which can provide a productivity advantage of up to 2.5 times the number of chips. • Improved overall utilization of silicon wafers: Manufacturing rectangular silicon wafers on round silicon wafers will make some areas at the edge of the silicon wafer unusable, while the increase in the size of the silicon wafer reduces the loss ratio of unused edges. • Improved equipment capacity: Under the condition that the basic process flow: thin film deposition → photolithography → etching → cleaning and other basic development conditions remain unchanged, the average production time of a chip is shortened, the equipment utilization rate is improved, and the company's production capacity is expanded.
Processes and semiconductor products corresponding to different sizes of semiconductor silicon wafers
|
Semiconductor silicon wafer size |
Process |
Semiconductor products |
Application diagram |
|
6 inches and below |
0.35um and above |
Diodes, transistors, thyristors, etc. Various discrete devices |
|
|
8 inches |
90nm~0.35um |
Sensor chips, driver chips, power management chips, RF chips, etc. |
|
|
12 inches |
90nm and below |
CPU, GPU, Storage chip,FPGA, ASIC, etc. |
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