What Is The Thickness Of Semiconductor Silicon Wafers?

Jan 07, 2025 Leave a message

d03833d416aece8c3276496263dd3c3b720

Silicon wafers are one of the most important raw materials in the electronics industry, and are mainly used to manufacture integrated circuits, capacitors, diodes and other components. Integrated circuits are tiny circuits composed of a large number of basic components such as transistors, capacitors, resistors, etc., which can be used in various electronic devices such as computers, communication equipment, and entertainment equipment. Semiconductor silicon wafers are one of the core materials for manufacturing integrated circuits. The size of semiconductor silicon wafers is divided into 2 inches (50.8mm), 4 inches (100mm), 6 inches (150mm), 8 inches (200mm), and 12 inches (300mm) according to the diameter. Different silicon wafer sizes and processes are used according to different semiconductor products.

 

Semiconductor silicon wafer size classification

 

Silicon wafer size

Thickness

Area

Weight

Corresponding process

2 inches

50.8mm

279um

20.26cm²

1.32g

5um

4inches

100mm

525um

78.65cm²

9.67g

3um-0.5um

6 inches

150mm

675um

176.72cm²

27.82g

0.35um-0.13um

8 inches

200mm

725um

314.16cm²

52.98g

90mm-55mm

12 inches

300mm

775279um

706.12cm²

127.62g

28mm-3mm

Advantages of large-size silicon wafers • More chips can be manufactured on a single silicon wafer: The larger the wafer, the less waste there is at the edges and corners, which improves the utilization rate of the silicon wafer and reduces costs. Taking 300mm silicon wafers as an example, its usable area is twice that of 200mm silicon wafers under the same process, which can provide a productivity advantage of up to 2.5 times the number of chips. • Improved overall utilization of silicon wafers: Manufacturing rectangular silicon wafers on round silicon wafers will make some areas at the edge of the silicon wafer unusable, while the increase in the size of the silicon wafer reduces the loss ratio of unused edges. • Improved equipment capacity: Under the condition that the basic process flow: thin film deposition → photolithography → etching → cleaning and other basic development conditions remain unchanged, the average production time of a chip is shortened, the equipment utilization rate is improved, and the company's production capacity is expanded.

 

Processes and semiconductor products corresponding to different sizes of semiconductor silicon wafers

Semiconductor silicon wafer size

Process

Semiconductor products

Application diagram

6 inches and below

0.35um and above

Diodes, transistors, thyristors, etc.

Various discrete devices

info-168-81

8 inches

90nm~0.35um

Sensor chips, driver chips, power management chips, RF chips, etc.

info-164-80

12 inches

90nm and below

CPU, GPU,

Storage chip,FPGA, ASIC, etc.

info-177-74