About Sibranch Microelectronics
Founded in 2006 and headquartered in Ningbo, China, Sibranch Microelectronics was established by a team of materials science experts with deep roots in the semiconductor industry. Our mission is to deliver high-quality semiconductor wafers and related services to customers worldwide.
Our Product Range
We specialize in a comprehensive portfolio of silicon wafers, including:
- Standard single-side polished (SSP) and double-side polished (DSP) wafers
- Test wafers and prime grade wafers
- Silicon-on-Insulator (SOI) wafers
- Coinroll wafers
- Diameters available up to 12 inches
- Growth methods: CZ, MCZ, and FZ
- Custom options: Neutron irradiation, any crystallographic orientation, off-cut substrates, wide resistivity ranges (high & low), ultra-flat, ultra-thin, and thick wafers
Value-Added Services
Beyond wafer supply, our experienced team provides advanced processing capabilities:
- Thin film deposition (Oxide, Nitride, Metal layers)
- Silicon epitaxial growth and epitaxy services (SOS, GaN, GOI, etc.)
- Wafer thinning, back grinding, and dicing
Specialty Wafers
We also supply a wide range of specialty crystalline substrates:
- Sapphire wafers: 2" to 8", available in A-plane, R-plane, M-plane, C-plane with epi-polish and fine grinding options
- GaAs wafers: 2" to 8", P-type, N-type, semi-conducting, and semi-insulating grades
- SiC wafers: 4" to 12", 4H-N, 6H-N, and 6H-SI polytypes
- Glass wafers: 1" to 12", Fused Silica, Borofloat, and B270 materials
- Single crystal quartz wafers: 2" to 6", X-cut, Y-cut, and Z-cut orientations
