Basic Introduction Of SOI Silicon Wafer

The company can provide customers with various specifications and high-quality SOI silicon wafers (Silicon On Insulator-Silicon On Insulator), which are suitable for customers in a wide range of applications including MEMS, power devices, pressure sensors and CMOS integrated circuit manufacturing. SOI wafers provide a good solution for high-speed and low-power devices, and are widely regarded as a new solution for high-voltage and RF devices. The SOI wafer is a sandwich-like sandwich structure with three layers; including the top layer (device layer), the middle buried oxide layer (insulating SiO2 layer) and the bottom substrate (bulk silicon). SOI wafers are produced using the SIMOX method and wafer bonding technology, so that thinner and more precise device layers, uniform thickness and low defect density can be achieved.