Preparation process of silicon wafer

The preparation process of silicon wafer mainly includes the following steps:
Melting silicon: First, extremely high-purity silicon is smelted at high temperature to form silicon liquid.
Single crystal growth: Then, the molten silicon liquid is grown into single crystal silicon by semiconductor technology such as Czochralski method or zone melting method.
Silicon ingot cutting: The grown monocrystalline silicon is cut into silicon wafers with a thickness of about 0.5-1mm.
Polishing: Finally, silicon wafers undergo a precision polishing process to obtain a smooth surface that meets the needs of electronic grade applications.