SiC Dummy Wafer

SiC Dummy Wafer

SiC dummy wafer is a high-quality product that is widely used in the semiconductor industry. It is a silicon carbide wafer that is designed specifically for testing and debugging semiconductor devices.
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Description
Technical Parameters
Product Description

 

SiC dummy wafer is a high-quality product that is widely used in the semiconductor industry. It is a silicon carbide wafer that is designed specifically for testing and debugging semiconductor devices. The SiC dummy wafer is an important tool for semiconductor manufacturers, as it helps them to ensure the quality and integrity of their products.

 

One of the key advantages of the SiC dummy wafer is its high purity and uniformity. This ensures that it provides accurate and reliable results in testing and debugging semiconductor devices. The wafer is also highly durable and resistant to damage, making it an ideal choice for use in harsh operating environments.

 

Another advantage of the SiC dummy wafer is its versatility. It can be used in a wide range of semiconductor applications, including power devices, RF devices, and optoelectronics. This makes it a valuable tool for semiconductor manufacturers who need to test a variety of devices.

 

4H N-TYPE SiC 100MM, 350μm WAFER SPECIFICATION

Artic le Number

W4H100N-4-PO (or CO)-350

Description

4H SiC Substrate

Polytype

4H

Diameter

(100+0.0-0.5) mm

Thickness

(350±25) μm (Engineering grade ±50μm)

Carrier Type

n-type

Dopant

Nitrogen

Resistivity (RT)

0.012-0.025Ω▪cm (Engineering grade <0.025Ω▪cm)

Wafer Orientation

(4+0.5)°

Engineering grade

Production Grade

Production Grade

2.1

2.2

2.3

Micropipe Density

≤30cm-²

≤10cm-²

≤1cm-²

Micropipe Free area

Not specified

≥96%

≥96%

Orientation flat (OF)

 

Orientation

Paralle {1-100} ±5°

Orientation flat length

(32.5±2.0) mm

ldentification flat (IF)

 

Orientation

Si-face: 90° cw, from orientation flat ±5°

ldentification flat length

(18.0+2.0) mm

 

Surface

Option1: Si-face standard polish Epi-ready C-face optical polish

Option2: Si-face CMP Epi-ready, C-face optical polish

Package

Multiple wafer (25) shipping box

(Single wafer package upon request)

 

6H N-TYPE SiC, 2"WAFER SPECIFICATION

Artic le Number

W6H51N-0-PM-250-S

Description

Production Grade 6H SiC Substrate

Polytype

6H

Diameter

(50.8±38) mm

Thickness

(250±25) um

Carrier Type

n-type

Dopant

Nitrogen

Resistivity(RT)

0.06-0.10Ω▪cm

Wafer Orientation

(0+0.5)°

Micropipe Density

≤100cm-²

Orientation flat orientation

Parallel {1-100} ±5°

Orientation flat length

(15.88±1.65) mm

Identification flat orientation

Si-face: 90° cw. frow orientation flat ±5°

ldentification flat length

(8+1.65) mm

Surface

Si-face standard polish Epi-ready

C-face matted

Package

Package single wafer package or multiple wafer shipping box

 

Product Picture

 

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SiC GaN Wafer

Why Choose Us

 

Our products are sourced exclusively from the world's top five manufacturers and leading domestic factories. Supported by highly skilled domestic and international technical teams and stringent quality control measures.

Our objective is to provide customers with comprehensive one-on-one support, ensuring smooth channels of communication that are professional, timely, and efficient. We offer a low minimum order quantity and guarantee swift delivery within 24 hours.

 

Factory Show

 

Our vast inventory consists of 1000+ products, ensuring that customers can place orders for as little as one piece. Our self-owned equipments for dicing & backgrinding, and full cooperation in the global industrial chain enable us prompt shipment to ensure customer one-stop satisfaction and convenience.

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Our Certificate

 

Our company takes pride in the various certifications we have earned, including our patent certificate, ISO9001 certificate, and National High-Tech Enterprise certificate. These certifications represent our dedication to innovation, quality management, and commitment to excellence.

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