Silicon wafer cutting process introduction

Wafer dicing is a critical part of the solar photovoltaic cell manufacturing process. This process is used to process solid silicon ingots of monocrystalline or polycrystalline silicon. The wire saw first cuts the silicon ingot into cubes and then into very thin wafers. These silicon wafers are the substrates on which photovoltaic cells are made.
The core of the modern wire saw is the ultra-fine high-strength cutting wire used to complete the cutting action with the cooperation of abrasive slurry. Up to 1000 cutting lines are wound parallel to each other on the guide wheel to form a horizontal cutting line "net". Motor-driven guide wheels move the entire cutting wire web at a speed of 5 to 25 meters per second. The speed of the cutting line, linear or back and forth, is adjusted to the shape of the ingot throughout the cutting process. During the movement of the cutting wire, the nozzle continuously sprays an abrasive slurry containing suspended silicon carbide particles towards the cutting wire.
Silicon blocks are fixed on the cutting table, usually 4 blocks at a time. The cutting table cuts the mesh vertically through the moving cutting wire, so that the silicon block is cut into silicon wafers.