Double Side Polished Silicon Wafers

Double Side Polished Silicon Wafers

Double side polished silicon wafers are a cutting-edge product that are revolutionizing the semiconductor industry. These wafers go through an intensive polishing process which ensures that they have a smooth, shiny and blemish-free surface on both sides.
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Description
Technical Parameters
Product Description

 

Polished silicon wafer parameters 1

Diameter

1 inch-12 inch

Thickness

280um, 300um, 380um, 400um, 500um, 525um, 675um and customize thick

Type

P-type and N-type

Doped

Undoped, Doped Boron, Doped Phosphorus or Arsenic

Orientation

<100>, <111>, <110>

Resistivity

1-10ohm.cm, 0.001-0.005ohm.cm, >1000ohm.cm and >20000ohm.cm

Polish

DSP

Method

CZ and FZ

Oxide layer

100, 200, 300nm+/-10%

Polished silicon wafer parameters 2

Diameter

50.8mm

76.2mm

100mm

125mm

150mm

200mm

Diameter tolerance

±0.4mm

±0.5mm

±0.5mm

±0.3mm

±0.3mm

±0.2mm

Thickness

280um

381um

525um

625um

675um

725um

Thick tolerance

±20um

±20um

±20um

±15um

±15um

±15um

TTV

≦8um

≦10um

≦10um

≦10um

≦10um

≦10um

Bending

≦25um

≦30um

≦40um

≦40um

≦50um

≦50um

TIR

≦5um

≦6um

≦6um

≦5um

≦5um

customize

Length of Primary Flat

16.0±2.0mm

22.5±2.5mm

32.5±2.5mm

42.5±2.5mm

57.5±2.5mm

customize

Length of secondary Flat

8.0±2.0mm

11.5±1.5mm

18.0±2.0mm

27.5±2.5mm

37.5±2.5mm

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Note: If there are special parameter requirements, can be customized

 

Double side polished silicon wafers are a cutting-edge product that are revolutionizing the semiconductor industry. These wafers go through an intensive polishing process which ensures that they have a smooth, shiny and blemish-free surface on both sides.

 

The benefits of using double side polished silicon wafers are endless. Firstly, they provide excellent electrical performance which makes them ideal for use in high-performance electronics such as microprocessors and memory devices. Secondly, their high-quality surface allows for more accurate and precise patterning of the semiconductor layers. This, in turn, translates into increased yield and efficiency in the production process.

 

Furthermore, the double side polishing process gives the wafers greater mechanical strength and durability, meaning that they are able to withstand the rigors of the manufacturing process without any damage. This, in turn, translates into less downtime and fewer losses due to wafer breakage.

 

In summary, if you want to take your semiconductor manufacturing to the next level, then using double side polished silicon wafers is the way to go. The benefits are numerous, and the quality and reliability of these wafers are unmatched. So why not take advantage of this cutting-edge technology and elevate your production capabilities today?

 

Product Picture

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Why Choose Us

 

Our products are sourced exclusively from the world's top five manufacturers and leading domestic factories. Supported by highly skilled domestic and international technical teams and stringent quality control measures.

Our objective is to provide customers with comprehensive one-on-one support, ensuring smooth channels of communication that are professional, timely, and efficient. We offer a low minimum order quantity and guarantee swift delivery within 24 hours.

 

Factory Show

 

Our vast inventory consists of 1000+ products, ensuring that customers can place orders for as little as one piece. Our self-owned equipments for dicing & backgrinding, and full cooperation in the global industrial chain enable us prompt shipment to ensure customer one-stop satisfaction and convenience.

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Our Certificate

 

Our company takes pride in the various certifications we have earned, including our patent certificate, ISO9001 certificate, and National High-Tech Enterprise certificate. These certifications represent our dedication to innovation, quality management, and commitment to excellence.

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