Our company provides wafer slicing and cutting services. With our advanced equipment and skilled technicians, we can accurately slice wafers into specified sizes and thicknesses. Our precise cutting technique ensures minimal kerf loss and enables us to deliver the highest yield of usable chips.
We also offer customized services to meet your unique requirements, including special shapes and edge profiles.
Our wafer slicing and cutting services are ideal for a variety of applications, such as semiconductor manufacturing, LED production, and MEMS devices.
After backgrinding, wafers must be diced to separate the individual silicon chips that are used in building electronic devices from the wafer itself. Wafer dicing can be achieved through scribing and breaking, by mechanical sawing, or by laser cutting. All methods are typically automated to ensure precision and accuracy.
The resulting cut pieces of wafer are referred to as die, dice, or dies. The die created may be of any shape with straight line edges, typically rectangles or squares. In rare instances, die will be cut in other, specialized shapes; this proce
ss must be performed with a laser dicer. Die generally range from 35 mm to 0.1 mm across, usually trending toward smaller end of measure.
In wafer dicing, the wafers are first mounted on dicing tape, similar to the tape used in backgrinding. This tape holds the wafer to a thin metal frame (saw frame) which supports it during the dicing process. The laser dicing process is an exception to this, as instead of a metal frame, the wafer is secured to an underlying carrier membrane that expands after the laser has made its cuts, inducing fracture and separating the dies10 .
We use state-of-the-art, dual spindle dicing saws to produce clean, precision cuts. Our expert team adheres to strict quality assurance processes to ensure each wafer dicing stage turns out cleaner wafers, minimizes distortions, and reduces material loss to create higher yields.
Contact us today to learn more about how our wafer slicing and cutting services can help you optimize your manufacturing process.
