Our company offers wafer thinning services that involve reducing the thickness of semiconductor wafers to a specific requirement. We utilize state-of-the-art equipment and precision cutting tools to achieve the desired thickness and surface flatness, ensuring high quality and uniformity throughout the wafer. Our wafer thinning service is suitable for a wide range of applications in the semiconductor industry, and we are dedicated to meeting the needs and specifications of our customers. With unparalleled expertise and a commitment to quality, we are the ideal partner for all your wafer thinning needs.
The maximum diameter of wafer thinning is 300mm, the maximum thickness of grinding thinning is 50μm, the accuracy is 3~5μm, and the grinding process surface is 100nm
