Wafer Resizing / Edge Rounding

Wafer Resizing/Coring Process

A process that cuts larger-diameter wafers into smaller-sized wafers, primarily used for special dimension requirements, sample preparation, or low-volume production.
 

Edge Rounding/Beveling Process

A process that grinds and polishes wafer edges to remove chipping and microcracks generated during dicing, thereby improving the mechanical strength of wafers. It is typically performed as a subsequent step to the wafer resizing process. 

SiBranch offers incredibly accurate and efficient silicon (Si) and silicon on insulator (SOI) wafer resizing services. Wafer resizing, also commonly referred to as wafer coring, downsizing, cut-down, or size reduction, involves cutting larger wafers into smaller diameters while maintaining strict dimensional tolerances. We accept orders ranging from single prototype wafers to high-volume production of hundreds of wafers per month.
As part of our resizing process, we also provide precision edge rounding (edge beveling) services to eliminate edge chipping, microcracks, and stress concentrations, significantly improving wafer mechanical strength and processing yield.
We regularly process wafers in all standard diameters: 2" (50 mm), 3" (75 mm), 4" (100 mm), 5" (125 mm), 6" (150 mm), 8" (200 mm), and 12" (300 mm), with custom sizes available upon request.

Capabilities

The following are our wafer resizing capabilities:

Process any wafer diameter up to 300mm

Process wafers as thin as 0.150mm

Achieve completed resized wafers anywhere from 50mm to 200mm

Produce multiple resized wafers from a single wafer. For example, we can produce two 100mm wafers from a single 200mm wafer.

Produce SEMI-standard flat +/- 0.002 degrees

Produce SEMI-standard notch in resized wafers

Tolerance of +/- 0.100mm on the OD dimension

Tolerance of +/- 0.050mm on the center position

Offset the wafer center to maximize the die yield

Laser scribe the wafer ID on the resized wafer for wafer identity control

Wafer edge rounding / beveling

High-purity deionized (DI) water grinding coolant

Trim, thin, or step the edge of resized wafers

Dice complete die from remnants of original wafer